EXTEC High Concentration Diamond Wafering Blades---高密度钻石切割碟

货号	描述	包装
推荐用途：金属基复合材料、钛、热喷涂涂料、印刷电路板、骨头。
12200	3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)	Each
12205	4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)	Each
12210	5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)	Each
12215	6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)	Each
12220	7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)	Each
12218	8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)	Each
推荐用途：难切割的，磁性材料和非磁性材料。
12252	5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)	Each
12253	7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)	Each
12254	8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)	Each

EXTEC High Concentration EP Diamond Wafering Blades---EP型高密度钻石切割碟

货号	描述	包装
推荐用途：高分子材料，橡胶，软性、黏性材料。
12222	4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)	Each
12224	5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)	Each
12226	7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)	Each
12228	8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)	Each

美国Extec 低密度钻石切割碟请联络上海益朗仪器有限公司，谢谢！